l 4 - 4 7 n k - 1 0 (a) (b) (d) 1. part no. expression : (b) inductance code : 47n = 0.047uh (c) tolerance code : k = 10%, m = 20% (a) series code 2. configuration & dimensions : 4. materials : superworld electronics (s) pte ltd (a) body : ferrite (b) termination : ag/ni/sn a 3. schematic : (d) : 10 : rohs compliant 5. general specification : b) rated current : base on temp. rise a) temp. rise : 30c max. l4 series ferrite chip inductors pg. 1 note : specifications subject to change without notice. please check our website for latest information. 03.08.2010 pcb pattern h g 1.600.20 bd 2.20 ref. 1.40 ref. 4.40 ref. ghl unit:m/m l 3.200.20 a 1.100.30 c a d b 0.500.30 b ag(100%) ni(100%)-1.5um(min.) sn(100%)-3.0um(min.) c) storage temp. : -40c to +85c d) operating temp. : -40c to +85c e) resistance to solder heat : 260c.10secs (c) c 11 ~ 99 : internal controlled number
superworld electronics (s) pte ltd ferrite chip inductors l4 series note : specifications subject to change without notice. please check our website for latest information. pg. 2 03.08.2010 6. electrical characteristics : ( mhz ) frequency 20 1206 0.270 l4-r27 - 50 1206 6.800 l4-6r8 - inductance tolerance : 1206 1206 l4-100 - l4-8r2 - m : 20% : k : 10% 10.000 8.200 50 50 1206 1206 1206 1206 1206 1206 1206 1206 1206 1206 1206 1206 1206 1206 1206 1206 l4-1r5 - l4-2r2 - l4-1r8 - l4-2r7 - l4-4r7 - l4-3r9 - l4-3r3 - l4-5r6 - l4-r39 - l4-r56 - l4-r47 - l4-r68 - l4-1r2 - l4-1r0 - l4-r82 - l4-r33 - 3.300 4.700 5.600 3.900 2.200 2.700 1.500 1.800 45 45 50 45 45 45 45 45 0.560 1.200 1.000 0.680 0.820 0.390 0.470 0.330 25 45 45 25 25 25 25 20 1206 1206 1206 1206 1206 1206 1206 size eia part number l4-r22 - l4-r12 - l4-r15 - l4-r18 - l4-r10 - l4-68n - l4-47n - q inductance 0.220 0.180 0.120 0.150 ( h ) 0.100 0.068 0.047 20 20 20 20 min 20 20 20 250 150 0.50 25 29 25 0.80 4 1.00 0.90 26 24 2 4 25 25 0.50 0.50 0.60 0.60 0.70 0.90 0.80 0.70 0.60 0.60 0.70 0.80 0.90 0.50 0.40 0.50 60 55 50 45 38 41 32 35 10 10 4 10 10 10 10 10 145 125 105 115 135 65 75 100 25 10 10 25 25 25 25 25 50 50 50 50 50 50 50 25 250 200 200 150 100 100 150 250 0.40 0.30 0.40 0.30 0.25 max. 0.25 0.15 dc resistance (
) ( mhz ) 320 235 200 220 280 170 185 min. 25 25 25 25 25 50 50 srf test rated current 250 250 250 250 250 300 300 ( ma )
note : specifications subject to change without notice. please check our website for latest information. superworld electronics (s) pte ltd pg. 3 03.08.2010 ferrite chip inductors l4 series 7. impedance vs. frequency curves : 110100 frequency(mhz) 0 20 40 60 80 10 0 12 0 q fci3216-series q vs freq. r12 1r0 4r7 100 330 q vs. frequency 1101001000 dc current(ma) 0.1 1 10 100 i nductance(uh) fci3216-series l vs idc. 330 100 4r7 1r0 l vs. idc
note : specifications subject to change without notice. please check our website for latest information. superworld electronics (s) pte ltd pg. 4 03.08.2010 ferrite chip inductors l4 series 8. reliability & test condition : bending 40(1.575) not be damaged by the forces applied on the the terminal electrode & the dielectric must flexture strength 100(3.937) 45(1.772) right conditions. 45(1.772) 20(.787) solder a chip on a test substrate, bend the substrate by 2mm (0.079in) and return. test condition performance not be damaged by the forces applied on the the terminal electrode & the dielectric must more than 90% of the terminal electrode refer to standard electrical characteristics list 100.5 seconds 60 seconds terminal strength solderability right conditions. w should be covered with solder. 60 seconds preheating 245c 150c 41.0 seconds cooling dipping natural solder heat resistance temperature rise test electrical characteristics test rated current dc resistance impedance preheating 30c max. ( ? t) 260c 150c dipping cooling natural for z / l series : solder : sn-ag3.0-cu0.5 flux for lead free : rosin dip time : 41sec. preheat : 150c, 60sec. solder temper ature : 2455c 2. temperature measured by digital surface thermometer. flux for lead free : rosin dip time : 100.5sec. preheat : 150c, 60sec. solder : sn-ag3.0-cu0.5 solder temper ature : 2605c 1. applied the allowed dc current. hp4291a, hp 4287a+ 16092a hp4338b no mechanical damage remaining terminal electrode : 70% min. w item 0.2 1 2.0 8 1.0 5 6 7 1.0 1.5 2 3 4 0.6 0.5 1.0 > 25 size force (kfg) time (sec)
1a 1.5a 3a 2a 6a 5a 4a 4 5 6 2 3 1 0 derating derated current(a) operating temperature(x c) 125 85 operating temperature(c) superworld electronics (s) pte ltd note : specifications subject to change without notice. please check our website for latest information. pg. 5 03.08.2010 ferrite chip inductors l4 series derating curve for the ferrite chip bead which withstanding current over 1.5a, as the operating temperature over 85c, t he derating current information is necessary to consider with. for the detail derating of current, please refer to the derated current vs. operating temperature curve. not be allowed. appearance : cracking, shipping & any other defects harmful to the characteristics should the ferrite should not be damaged by forces applied on the right condition. random vibration test bending st rength item 1.0(0.039) r0.5(0.02) directions (total 6 hours). amplitude : 1.52mm frequency : 10-55-10hz for 1 min. directions & times : x, y, z directions for 2 hours. a period of 2 hours in each of 3 mutually perpendicular a performance test condition chip height of 75cm. drop 10 times on a concrete floor from a drop no mechanical damage appearance : no damage. inductance : within 10% of initial value. temperature loading at high humidity : 90~95% rh. temperature : 402c duration : 100812hrs duration : 100812hrs applied current : rated current temperature : 855c measured at room temperature after placing for 2 to 3hrs. measured at room temperature after placing for 2 to 3hrs. humidity measured : 100 times appearance : no damage. phase inductance : within 10% of initial value. low temperature storage test thermal shock number of cycles : 100 step2 : +855c 303 min. duration : 100812hrs temperature : -552c measured at room temperature after placing for 2 to 3hrs. measured at room temperature after placing for 2 to 3hrs. +855c -402c 2 1 303 303 for l series : step1 : -402c 303 min. condition for 1 cycle temperature (c) times (min.) height of 75cm. drop 10 times on a concrete floor from a drop no mechanical damage 8. reliability & test condition : q : within 30% of initial value. q : within 30% of initial value. 2.5 2.70 (0.106) 7 8 0.80 (0.033) mm (inches) 1.40 (0.055) 2.00 (0.079) 3 4 5 6 series name 2 1.0 2.5 0.3 p-kgf for z / l series :
note : specifications subject to change without notice. please check our website for latest information. superworld electronics (s) pte ltd pg. 6 03.08.2010 ferrite chip inductors l4 series 9. soldering and mounting : products, wave soldering of large size products is discouraged. recommended temperat ure profile for wave soldering seen by the circuit when immersed in the molten solder wave , typical at 230c. due to the risk of thermal damage to 9-2.2 solder wave : wave soldering is perhaps the most rigorous of surface mount soldering processes due to the steep rise in temperature 9-1. recommended pc board pattern air soldering tools. 9-2.3 soldering iron (figure 3) : 9-2.1 lead free solder re-flow : wave and re-flow soldering systems. if hand soldering cannot be avoided, the preferred techni que is the utilization of hot by the difference in coefficients of expansion between solder, chip and substrate. the terminations are suitable for all mildly activated rosin fluxes are preferred. the minimu m amount of solder can lead to damage from the stresses caused recommended temperature profiles for re-flow soldering in figure 1. products attachment with soldering iron is discouraged due to t he inherent process control limitations. in the event that a) preheat circuit and products to 150c. b) 350c tip temperature (max) 60~120s figure 1. re-flow soldering 30~60s c) never contact the ceramic with the iron tip a soldering iron must be employed the following precautions are recommended. temperature c 230 250 ~ 260 150 180 preheating note : 9-2. soldering temperature c 330 over 2min. figure 2. wave soldering gradual cooling within 3s e) use a 20 watt soldering iron with tip diameter of 1.0mm f) limit soldering time to 3 secs. d) 1.0mm tip diameter (max) soldering cooling natural 260 245 150 under mechanical stress as warping the board. the mechanical stress to prevent failure. products shall be positioned in the sideway direction against pc board should be designed so that products are not sufficient figure 3. hand soldering gradual cooling temperature c over 1min. time(sec.) 350 150 preheating soldering cooling natural preheating soldering cooling natural (max.) (max.) 3s 10s 10s max. 1.40 4.40 2.20 is shown in fig. 2
superworld electronics (s) pte ltd note : specifications subject to change without notice. please check our website for latest information. pg. 7 03.08.2010 ferrite chip inductors l4 series may cause the failure of mechanical or electrical perform ance. solder shall be used not to be exceed as shown in fig. 4. accordingly increasing the solder volume, the mechanical st ress to product is also increased. exceeding solder volume figure 4 recommendable upper limit t 9-3. solder volume
superworld electronics (s) pte ltd note : specifications subject to change without notice. please check our website for latest information. pg. 8 03.08.2010 ferrite chip inductors l4 series 10-1. reel dimension 7" x 12mm r0.5 r10.5 13.50.5 7" x 8mm d b 7" x 8mm c 1 2 0 7" x 12mm r1.9 20.5 a 178.02.0 178.02.0 60.02.0 b(mm) 60.02.0 13.50.5 9.00.5 a(mm) type 13.50.5 13.50.5 c(mm) d(mm) 10. packaging information : 10-2 tape dimension / 8mm material : paper p po:40.1 material : plastic po:40.1 p d1:1.50.1 10-2.1 tape dimension / 12mm f:5.50.05 e:1.750.1 d:1.5+0.1 p2:20.05 f:3.50.05 e:1.750.1 p2:20.1 f:3.50.1 e:1.750.1 4.00.1 p(mm) 4.00.1 4.00.1 4.00.1 4.00.1 8.00.1 4.00.1 p(mm) 8.00.1 z / l series bo w:12.00.1 p ao a ko section a-a p2:20.05 a po:40.1 t 8 6.100.1 2.000.1 5.400.1 bo(mm) size 7 6 4.950.1 4.950.1 ao(mm) ko(mm) 1.850.1 1.930.1 3.660.1 1.930.1 series z / l bo w:8.00.1 ao d1:10.1 a section a-a ko a d:1.5+0.1 t 2.250.10 1.420.10 1.040.10 3(09) 1.500.10 1.880.10 2.770.10 5 3.420.10 4 3(12) 2.350.10 3.500.10 1.550.10 1.450.10 1.270.10 1.050.10 2 size 1.950.10 bo(mm) ko(mm) 1.050.10 ao(mm) 0.300.05 1.50.1 d1(mm) t(mm) 0.240.05 0.240.05 1.50.1 1.50.1 1.00.1 0.220.05 0.220.05 1.00.1 0.220.05 0.220.05 1.00.1 1.00.1 t(mm) 0.230.05 d1(mm) none 2.00.1 p(mm) 4.00.1 4.00.1 series z / l ao d:1.56 +0.1 -0.05 bo w:8.00.1 ko t 0.620.03 1.500.05 1.050.05 1.850.05 2 3(09) 2.300.05 1 size bo(mm) 1.120.03 0.950.05 0.950.05 ko(mm) 0.600.03 ao(mm) none 0.950.05 0.950.05 none t(mm) 0.600.03 d1(mm) none
note : specifications subject to change without notice. please check our website for latest information. superworld electronics (s) pte ltd pg. 9 03.08.2010 ferrite chip inductors l4 series 12000 1000 40000 4000 20000 7000 bulk (bags) chip size chip / reel inner box middle box 4000 carton 40000 20000 1000 8 50000 20000 30000 100000 2500 12500 62500 125000 8000 40000 80000 6 2000 75 10000 15000 75000 150000 50000 100000 4 3000 3 (12) 2000 300000 200000 150000 10000 50000 250000 500000 20000 20000 100000 200000 200000 100000 3 (09) 4000 4000 21 10-3. packaging quantity the force for tearing off cover tape is 15 to 60 grams in the arrow direction under the following conditions. 300 (mm/min) tearing speed room atm room temp. room humidity 2. transportation : a) products should be handled with care to avoid damage or contamination from perspiration and skin oils. c) bulk handling should ensure that abrasion and mechanical shock are minimized. b) the use of tweezers or vacuum pick up is strongly recommended for individual components. c) the packaging material should be kept where no chlorine or sulfur exists in the air. application notice b) recommended products should be used within 6 months from the time of delivery. 1. storage conditions : a) temperature and humidity conditions : -10 ~ 40c and 30 ~ 70% rh. to maintain the solderabililty of terminal electrodes : top cover tape base tape (%) 45~85 (c) 5~35 860~1060 (hpa) 10-4. tearing off force 165 to 180 f
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